Electromigration-induced extrusion failures in Cu/low-k interconnects
نویسندگان
چکیده
Frank L. Wei, Chee Lip Gan, Tam Lyn Tan, Christine S. Hau-Riege, Amit P. Marathe, Joost J. Vlassak, and Carl V. Thompson Department of Materials Science and Engineering, Massachusetts Institute of Technology, 77 Massachusetts Ave., 13-5142, Cambridge, Massachusetts 02139, USA School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Ave., Singapore 639798, Singapore Advanced Micro Devices, 1 AMD Place, Sunnyvale, California 94086, USA School of Engineering and Applied Sciences, Harvard University, 29 Oxford St., 311, Cambridge, Massachusetts 02138, USA
منابع مشابه
APPLIED PHYSICS REVIEWS—FOCUSED REVIEW Recent advances on electromigration in very-large-scale-integration of interconnects
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